H&S HighTech

Business Areas
Materials Business

Materials Business

ACF – Anisotropic Conductive Film

ACF is suitable for creating electronic interconnections using conductive particles dispersed in adhesive.
It achieves electrical conductivity in the vertical direction at a certain temperature and pressure while requiring insulation between neighboring circuits and providing good adhesion.

Structure & Bonding Mechanism

Core Technology

NFA (Non-Flow ACF) Technology

Application

Fine-pitch electrodes in OLB, COG, COP, etc. → Prevents open-circuit and fine-pitch short-circuit defects

HDF (Hyper Distribution ACF) Technology

Application

Fine-pitch electrodes in OLB, COG, COP, μ-LED, and camera modules, etc.

→ Prevents open-circuit and fine-pitch short-circuit defects.

PMF (Pattern Matching Film) Technology

Application

Ultra-fine-pitch electrodes in OLB, COG, COP, and camera modules, etc.

→ Prevents open-circuit and fine-pitch short-circuit defects.

1. Definition

High-performance thermosetting adhesive film containing no conductive particles
Adhesive film optimized for fine-pitch and solder-bump bonding
Compatible with thermal compression (TC) bonding processes completed within 10 seconds, while providing excellent thermal curing performance

2. Key Applications

Packaging and interconnection of solder bumps and metal bumps
Fine-pitch circuit interconnection for semiconductor and display modules, including flip-chip bonding, IC packaging, and chip-on-film (COF) applications
Reliable electrical interconnection between metal pads made of gold (Au), nickel (Ni), copper (Cu), ITO, and other conductive materials

3. Key Technical Advantages

Excellent Adhesion: Provides strong interfacial adhesion and minimizes interfacial delamination
Precise Flow Control: Controls melt viscosity to prevent bump short-circuit and open-circuit defects

1. Definition

Insulating film for fine-circuit formation

: An inorganic-filler-loaded epoxy resin film used to build up fine-pattern circuit layers on a core substrate when processing large-area semiconductor package substrates (FC-BGA) for high-performance CPUs, GPUs, and similar devices
Main components: A blend of curable epoxy resin, curing agent, and nano-sized silica (SiO2) inorganic filler

2. Key Applications

High-performance semiconductor package substrates (FC-BGA/FC-CSP)

: Fine interlayer insulation for interposers and package substrates that connect the main die to the mainboard in AI accelerators, server CPUs, high-performance GPUs, autonomous-driving APs, and more
High-density multilayer build-up substrates (HDI)

: Fine-circuit build-up processes for compact, highly integrated boards such as smartphone mainboards and network switches

3. Key Technical Advantages

Ultra-fine line and space (L/S)
Low coefficient of thermal expansion (Low CTE)
Excellent insulation reliability and high-frequency performance: low dielectric constant and low dielectric loss
Strong plating adhesion and controlled surface roughness

1. Definition

Ultra-low-loss substrate bonding material – minimizing transmission loss in 5G ultra-high-frequency bands
High-performance thermosetting/thermoplastic adhesive film with controlled polar groups in its molecular structure

2. Key Applications

5G mmWave antenna cables: interlayer bonding of high-speed transmission lines (MPI/LCP-based FPCBs) in the 10–40 GHz band
Multilayer FPCB lamination and insulation: coverlay for preventing crosstalk and protecting circuits in high-density multilayer boards
Next-generation interconnects: flexible cables for high-speed data transmission modules (USB4, PCIe Gen5/6, Thunderbolt)

3. Key Technical Advantages

Excellent high-frequency dielectric properties
Dielectric constant (Dk) of 2.2–2.5 and dissipation factor (Df) of 0.0015–0.003 at 10 GHz, minimizing signal loss
High-temperature reflow resistance

ACF
(Anisotropic Conductive Film)

ACF is an insulating adhesive film in which fine conductive balls or particles are dispersed. When heat and pressure are applied, the conductive particles trapped between opposing electrodes establish electrical conduction in the vertical, or Z-axis, direction while maintaining insulation in the horizontal, or X-Y plane. This anisotropic conductivity enables fine-pitch circuits to be interconnected without electrical shorting between adjacent electrodes.

H&S HighTech’s ACF is a key electronic material that provides both electrical interconnection and mechanical bonding for fine-electrode components used in display panels, camera modules, flexible printed circuit boards (FPCBs), and chip-on-film (COF) packages. This is achieved by uniformly dispersing and arranging fine conductive particles within an insulating adhesive film. Leveraging its conductive-particle alignment and ultra-uniform distribution technologies, H&S HighTech is developing a portfolio of high-performance ACF products designed for next-generation interconnection applications, including fine-pitch assemblies, high-resolution displays, and MicroLED devices.

OLB : COF on Glass

Application

TV, MNT(LCD display, OLED display, high-resolution display, fine pitch, narrow bezel display) Laptop, Tablet, Mobile, Signage, ESL…

FOB : FPC/COF on Board

Application

TV,Monitor, N-PC, Tablet, Mobile, Signage…

COG : Chip on Glass

Application

OLED display, Foldable display, Laptop, Tablet, Mobile, ESL …

FOG : FPCB on Glass

Application

Fingerprint recognition sensor, OLED Mobile display, Automotive display, Laptop, Tablet, ESL …

COP : Chip on Plastic

Application

Mobile OLED display, Foldable OLED display…

FOP(S) : Film on Plastic / Si-wafer

Application

AR/VR, Mobile OLED display, Foldable OLED display…

CM : Camera Module

Application

Mobile, Automotive...

MicroLED

MicroLED is a next-generation display technology that creates images using microscopic light-emitting diodes (LEDs).
Each pixel emits its own light, enabling high brightness and outstanding color reproduction.

MicroLED displays offer a high contrast ratio, fast response time, low power consumption, and long operational life, providing superior performance compared with conventional display technologies.
They are also highly resistant to burn-in and offer excellent durability, ensuring stable image quality across a wide range of operating environments.

Owing to these advantages, MicroLED is gaining significant attention as a key technology for advanced display applications, including large-format displays, next-generation TVs, wearable devices, and augmented reality/virtual reality (AR/VR) systems.