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R&D > Functional liquid adhesives

Under fill & fill

Author 관리자 Date 2020-12-21 Views 186

Specification of thermal curing type adhesives

 

▣ High adhesive strength after curing(>30MPa)   ▣ High modulus(>2.5GPa) & high Tg(~125℃)

▣ High thermal stability (CTE α’<65, α“<200)