Fine pitch is required due to the high performance of the display.
H&S hightech developed an hyper-distribution ACF with low electrical contact resistance in a circuit with a small minimum contact area with a uniform distance between the balls and a uniform amount of capture using conductive ball array technology.
Stable contact resistance is realized by uniform the number of captures due to the uniform distribution of conductive balls compared to conventional ACF.
Hyper-distribution ACF is transfer method, both large-area sheet type and reel type can be supplied, and it can be applied to both large and small area applications.
Hyper-distribution ACF has no short-circuit between bumps due to low ball density, it can be applied to fine pitch.