COP
Features
| ITEM | Conductive Particle | Pitch Size | Main bonding Condition | TDS | ||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Series | Image | Type | Size | Density | Line | Space | Temp | Time | Pressure | File |
| TCP9032 series |  |
Ni polymer | 3.25㎛ | 20,000 | 600㎛2 | 6㎛ | 160±20℃ | ≥5sec |  |
|
Features
| ITEM | Conductive Particle | Pitch Size | Main bonding Condition | TDS | ||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Series | Image | Type | Size | Density | Line | Space | Temp | Time | Pressure | File |
| TCP9032 series | |
Ni polymer | 3.25㎛ | 20,000 | 600㎛2 | 6㎛ | 160±20℃ | ≥5sec | |
|