COG (Glass/Film/Hyper-Distribution Technology)
Features
- Fine pitch interconnection : min. 4.5㎛ gap for COG application
- Minimum connecting area of bump: 500㎛2.
- High reliability and adhesion, capture rate property.
| ITEM | Conductive Particle | Pitch Size | Main bonding Condition | TDS | ||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Series | Image | Type | Size | Density | Line | Space | Temp | Time | Pressure | File |
| TCG1031 Series |  |
Ni/Au polymer | 3.25 ㎛ | 45,000 pcs/mm2 | 1200 ㎛2 | 10 ㎛ | 210±20 ℃ | ≥5 sec | 50~90 MPa |  |
| TCG8031 series |  |
Ni/Au polymer | 3.25 ㎛ | 60,000 pcs/mm2 | 800 ㎛2 | 6 ㎛ | 150±20 ℃ | ≥5 sec | 50~90 MPa | |
| TCG8032 series |  |
Ni/Au polymer | 3.25 ㎛ | 24,000 pcs/mm2 | 500 ㎛2 | 4.5 ㎛ | 150±20 ℃ | ≥5 sec | 50~90 MPa | |