OLB (LCD / OLED / Hyper-Distribution Technology )
Features
- Fine pitch interconnect : 20 μm fine pitch for TFT-LCD, color STN, EL,
- High adhesion, high reliability, void-free bonding, and repairable by common solvents.
- Low bonding temperature and quick bonding time.
| ITEM | Conductive Particle | Pitch Size | Main bonding Condition | TDS | ||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Series | Image | Type | Size | Density | Line | Space | Temp | Time | Pressure | File |
| OLB-1 |  |
Ni/polymer | 3 ㎛ | 14,500 | 4,000 ㎛2 | 4 ㎛ | 150~200 ℃ | 4 sec | 3~5 MPa |  |
| OLB-2 |  |
Ni/polymer | 4 ㎛ | 5,000 | 7,000 ㎛2 | 7 ㎛ | 130~190 ℃ | 4 sec | 3~5 MPa | |
| OLB-3 |  |
Ni/polymer | 4 ㎛ | 5,000 | 7,000 ㎛2 | 7 ㎛ | 140~190 ℃ | 4 sec | 3~5 MPa | |
| OLB-HED |  |
Ni/polymer | 3 ㎛ | 8,000 | 1,500 ㎛2 | 4 ㎛ | 150~190 ℃ | 4 sec | 3~6 MPa | |