KOR | ENG | CHN

PCB


Features

  • - High adhesion for COF&FPC
  • - Good contact resistance for reliability
  • - Good for wide bonding temp. range
ITEM Conductive Particle Pitch Size Main bonding Condition TDS
Series Image Type Size Density Line Space Temp Time Pressure File
PCB-1 제품이미지 Ni particle 3 ㎛ 10,000 pcs/mm2 60,000 ㎛2 50 ㎛ 130~190 ℃ 4 sec 2.0~5.0MPa 다운로드
PCB-2 제품이미지 Ni particle 5 ㎛ 10,000 pcs/mm2 30,000 ㎛2 20 ㎛ 130~200 ℃ 4 sec 2.5~5.0MPa 다운로드
PCB-3 제품이미지 Ni particle 5 ㎛ 10,000 pcs/mm2 40,000 ㎛2 50 ㎛ 140~200 ℃ 4 sec 2.0~5.0MPa 다운로드