PCB
Features
- - High adhesion for COF&FPC
- - Good contact resistance for reliability
- - Good for wide bonding temp. range
| ITEM | Conductive Particle | Pitch Size | Main bonding Condition | TDS | ||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Series | Image | Type | Size | Density | Line | Space | Temp | Time | Pressure | File |
| PCB-1 |  |
Ni particle | 3 ㎛ | 10,000 pcs/mm2 | 60,000 ㎛2 | 50 ㎛ | 130~190 ℃ | 4 sec |  |
|
| PCB-2 |  |
Ni particle | 5 ㎛ | 10,000 pcs/mm2 | 30,000 ㎛2 | 20 ㎛ | 130~200 ℃ | 4 sec | |
|
| PCB-3 |  |
Ni particle | 5 ㎛ | 10,000 pcs/mm2 | 40,000 ㎛2 | 50 ㎛ | 140~200 ℃ | 4 sec | |
|